International Organizing Committee - Europe

Philip Azariadis, University of Aegean, GREECE

Charyar Mehdi-Souzani, LURPA - ENS CACHAN, FRANCE

Claire Lartigue, LURPA - ENS CACHAN, FRANCE

Michele Germani, Università Politecnica delle Marche Via Brecce Bianche, ITALY

James Gao, University of Greenwich, UK

Juan Carlos Torres, Universidad Granada, SPAIN

Peter Hehenberger, Johannes Kepler University, AUSTRIA

Caterina Rizzi, University of Bergamo, ITALY

Giorgio Colombo, Polytechnico di Milano, ITALY

Monica Bordegoni, Politecnico di Milano, ITALY

Francesco Ferrise, Politecnico di Milano, ITALY

Marco Bertoni, Blekinge Institute of Technology, SWEDEN

Joel Johansson, Jönköping University, SWEDEN

Panagiotis Kyratsis, University of Western Macedonia, GREECE

Sasa Cukovic, University of Kragujevac, SERBIA

International Organizing Committee - Americas

Eraldo Jannone da Silva, Universidade de Sao Paulo, BRAZIL

Joe Cecil, Oklahoma State University, USA

James Yang, Texas Tech University, USA

Jie Shen, University of Michigan - Dearborn, USA

Qinghin Peng, University of Manitoba, CANADA

Ahmad Barari, University of Ontario Institute of Technology, CANADA

Remus Tutunea-Fatan, Western University, CANADA

Dina Rochman, Universidad Autónoma Metropolitana, MEXICO

C. Greg Jensen, Brigham Young University, USA

Ramy Harik, University of South Carolina, USA

Paul Rosen, University of Utah, USA

Stephen Baek, The University of Iowa, USA

International Organizing Committee - Middle-East

Anath Fisher, Technion, ISRAEL

Ahmad Nasri, American University of Beirut, LEBANON

Khairan Rajab, Najran University, SAUDI ARABIA

Wael Abdelhameed, University of Bahrain, BAHRAIN

Tamer Shahin, United Arab Emirates University, UAE

Miri Weiss-Cohen, Braude College of Engineering, ISRAEL

International Organizing Committee - Asia

Hui Zhang, School of Software, Tsinghua University, CHINA

Nadia Magnenat-Thalmann, Nanyang Technological University, SINGAPORE

Puneet Tandon, PDPM Indian Institute of Information Technology, INDIA

Jianmin Zheng, Nanyang Technological University, SINGAPORE

Takashi Kanai, University of Tokyo, JAPAN

Shi-Min Hu, Tsinghua University, CHINA

Zhongke Wu, Beijing Normal University, CHINA

Tae-wan Kim, Seoul National University, KOREA

Junhai Yong, Tsinghua University, CHINA

Norimasa Yoshida, Nihon University, JAPAN

Masaji Tanaka, Okayama University of Science, JAPAN

Kenjiro Miura, Shizuoka University, JAPAN

Lujie Chen, LuBan 3D Pte. Ltd., SINGAPORE

Conference Sponsor